- Composed of a non-acid soldering flux in a semi-solid form, minimizing spillage risks.
- Demonstrates a robust ability to remove oxides from gold-copper alloy substrates and wires.
- Offers powerful soldering capabilities, resulting in high-strength joints with minimal residue.
- Maintains stability and exhibits low volatility, ensuring extended usage without toxicity or unpleasant odors.
- A valuable addition to high-quality electronic manufacturing processes.
- An invaluable aid for maintenance engineers as well.
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