- 20ml epoxy remover for BGA IC glue.
- Effortlessly softens and removes sealing glue from mobile phone chip BGA IC.
- Rapidly loosens solidified resin adhesives like epoxy, phenolics, acrylate, polyurethane, and organosilicon.
- Guarantees the safety of your circuit board and components.
- Environmentally friendly and free from Benzene Coderivative substances linked to leukemia.
- User-friendly and convenient to apply.
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