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KAISI BGA-IC Remover

KAISI BGA-IC Remover

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8 $

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KAISI BGA-IC Adhesive Glue Remover: 20ml Repair Liquid for Cleaning Phone CPU Chips, Using Solvent-Based Epoxy Remover with Water Solution.

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Estimated Delivery: 12-26 days (International), 3-6 days (United States)
Return within 45 days of purchase. Duties & taxes are non-refundable.
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Description

 

  • 20ml epoxy remover for BGA IC glue.
  • Effortlessly softens and removes sealing glue from mobile phone chip BGA IC.
  • Rapidly loosens solidified resin adhesives like epoxy, phenolics, acrylate, polyurethane, and organosilicon.
  • Guarantees the safety of your circuit board and components.
  • Environmentally friendly and free from Benzene Coderivative substances linked to leukemia.
  • User-friendly and convenient to apply.
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KAISI BGA-IC Remover
KAISI BGA-IC Remover
8 $
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