- Solder paste is a compound comprising solder powder, flux, and additional components.
- At room temperature, the tin solder paste exhibits specific viscosity, allowing initial positioning of electronic components.
- When subjected to soldering temperatures, the printed pad circuit and soldered components fuse together, forming a permanent connection. This process involves solvent evaporation and the influence of certain additives.
Brand | KAISI |
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Warranty | Quality |
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