KASI’s Lead-Free Soldering Paste Flux is designed for use in various temperature range of 138°C. It serves as a melting and spot welding flux suitable for PCBs, cups, LED repeaters, and various tools.
Solder paste is a compound comprising solder powder, flux, and additional components.
At room temperature, the tin solder paste exhibits specific viscosity, allowing initial positioning of electronic components.
When subjected to soldering temperatures, the printed pad circuit and soldered components fuse together, forming a permanent connection. This process involves solvent evaporation and the influence of certain additives.
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