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KAISI BGA-IC Remover
KAISI BGA-IC Adhesive Glue Remover: 20ml Repair Liquid for Cleaning Phone CPU Chips, Using Solvent-Based Epoxy Remover with Water Solution.
$8.00
20 in stock
- 20ml epoxy remover for BGA IC glue.
- Effortlessly softens and removes sealing glue from mobile phone chip BGA IC.
- Rapidly loosens solidified resin adhesives like epoxy, phenolics, acrylate, polyurethane, and organosilicon.
- Guarantees the safety of your circuit board and components.
- Environmentally friendly and free from Benzene Coderivative substances linked to leukemia.
- User-friendly and convenient to apply.
| Brand | KAISI |
|---|---|
| Warranty | Quality |
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