• 20ml epoxy remover for BGA IC glue.
  • Effortlessly softens and removes sealing glue from mobile phone chip BGA IC.
  • Rapidly loosens solidified resin adhesives like epoxy, phenolics, acrylate, polyurethane, and organosilicon.
  • Guarantees the safety of your circuit board and components.
  • Environmentally friendly and free from Benzene Coderivative substances linked to leukemia.
  • User-friendly and convenient to apply.
Brand

KAISI

Warranty

Quality

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